Posted in Announcements
JST-EERI US-Japan Collaborative Research - Tohoku Earthquake
Internship Positions for US PhD Students to Work with Japanese University Researchers
Professor Hitoshi Shiohara, University of Tokyo
Professor John Wallace, University of California, Los Angeles
Applications are sought from PhD students working with US faculty on earthquake engineering research related to structural engineering to work on tasks related to the Tohoku earthquake with Japanese university researchers. Potential Japanese host institutions/faculty include:
- University of Tokyo (Professor Hitoshi Shiohara),
- University of Tokyo, Earthquake Research Institute (Professor Toshimi Kabeyasawa),
- Tokyo Institute of Technology (Professor Kazuhiko Kasai),
- Hokkaido University (Professor Mitsumasa Midorikawa), and
- Tohoku University (Professor Masaki Maeda).
The anticipated duration of stay in Japan is one-month and travel/living expenses would be provided via funding from the Japan Science and Technology Agency (JST) in collaboration with EERI (funded separately by NSF Rapid). Visiting students would spend approximately two weeks working at the host institutions to help prepare reports related to the Tohoku Earthquake (in English). Although some understanding of the Japanese language would be helpful, it is not necessary. The remaining two weeks would be spent interacting with faculty and students outside of the host institution, visiting laboratories, and visiting areas impacted by the earthquake.
It is anticipated that student visits would occur between mid-to-late October and mid-December (depending on Japanese schedule, visit dates may extend into January). Applications will be accepted until the positions are filled; however, for full consideration, applications should be submitted no later than Wednesday, Oct. 5 (5PM PST).
Deadline: October 5, 2011 (5PM PST).
Expected Schedule: One-month visits between Oct. 15 and Dec 15, possibly late January.
Receipt of your application will be acknowledged.
Please fill in the application form by clicking on this link